Open Access Open Access  Restricted Access Subscription Access

Electronics Cooling Study of a CPU Using Forced Convection

Kancherla Shanmukh

Abstract


In this study, the performance of an air-cooled, flat-plate heat sink in forced convection was calculated using a three-dimensional analytical model. This study investigates the impact of heat sink thermal performance and external variables on the heat sink's thermal stress stability, which is critical for manufacturers' objectives. The influence of various characteristics on the heat transfer rate from the surface of a heat sink was examined. The results showed that convection-radiation heat transfer reduced the temperature by about 65 % of its initial value. To increase the air-cooling performance of plate-fin heat sinks, the slotted fin concept was used. The integral plate fin, discrete plate fin, and discrete slotted fin heat sinks were all subjected to numerical simulations of laminar heat transfer and flow pressure decrease. Discrete plate fin performance is better than integrated continuous plate fin performance at the same fan pumping power, and slotted fin performance is better than discrete plate fin performance. The authors then propose a novel sort of heat sink with discrete and slotted fin surfaces, thinner fins, and fewer intervals between fins. The Preliminary results had shown that a good cooling system with a reasonable convection coefficient of ambient air can result in good performance of the system. The findings and conclusions of this investigation will be presented in a future paper. This Analysis include 3D simulation, Designing of required parts and study on the obtained results.

Keywords


Three-dimensional analysis, computer cooling technology, air-cooled heat sink, forced convection, thermal performance

Full Text:

PDF

References


Alireza Moradikazerouni, Masoud Afrand, Jalal Alsarraf, Troung khang Nguyen-International

Journal of Heat and Mass Transfer Volume 134, May 2019, Pages 1218–1226.

S.M. Sohel Murshed, C.A. Nieto de Castro-Renewable and Sustainable Energy Reviews-Volume

, October 2017, Pages 821-833.

Introductory chapter: electronics cooling–An overview, Author: SMS Murshed-Electronics

Cooling, 2016-books.google.com

R. L. Webb, "Next generation devices for electronic cooling with heat rejection to air", Trans.

ASME J. Heat Transfer, vol. 127, pp. 2–10, 2005.

Alireza Moradikazerouni, Masoud Afrand, Jalal Alsarraf-Investigation of a computer CPU heat

sink under laminar forced convection using a structural stability method-International Journal of

Heat and Mass Transfer-Volume 134, May 2019, Pages 1218–1226.

Richard C. Chu-The Challenges of Electronic Cooling: Past, Current and Future-Journal of

Electronic Packaging-Dec 2004, 126(4): 491–500 (10 pages).

J. Davalath, Y. Bayazitoglu-Forced Convection Cooling Across Rectangular Blocks-Journal of

Heat Transfer-May 1987, 109(2): 321–328 (8 pages).

C.J. Shih, G.C. Liu-Optimal design methodology of plate-fin heat sinks for electronic cooling using

entropy generation strategy-IEEE Transactions on Components and Packaging Technologies

(Volume: 27, Issue: 3, Sept. 2004).

Marcia Barbosa Henriques Mantelli-Electronics Cooling. In: Thermosyphons and Heat Pipes:

Theory and Applications–23 December 2020.

Emre Ozturk, Ilker Tari-Forced Air Cooling of CPUs With Heat Sinks: A Numerical Study-IEEE

Transactions on Components and Packaging Technologies (Volume: 31, Issue: 3, Sept. 2008).

S. Lee-Optimum design and selection of heat sinks-IEEE Transactions on Components, Packaging,

and Manufacturing Technology: Part A (Volume: 18, Issue: 4, Dec 1995).

Hamdi E. Ahmed, B.H. Salman, A. Sh. Kherbeet, M.I. Ahmed-Optimization of thermal design of

heat sinks: A review-International Journal of Heat and Mass Transfer Volume 118, March 2018,

Pages 129–153.




DOI: https://doi.org/10.37628/ijtea.v7i2.1326

Refbacks

  • There are currently no refbacks.